Department of Computer Science
CONFERENCE PUBLICATIONS IN SMART MANUFACTURING
RECENT REFEREED CONFERENCE PAPERS IN SMART MANUFACTURING
- Cecil, J., Ramanathan, P., Huynh, H., A cloud-based cyber-physical framework for collaborative manufacturing, Proceedings of the 47th SME North American Manufacturing Research Conference, NAMRC 47, Erie, PA, June 10-14, 2019.
- Gupta, A., Cecil, J., Tapia, O, Sweet-Darter, M. (2019), Design of Cyber-Human Frameworks for Immersive Learning, Proceedings of the 2019 IEEE International Conference on Systems, Man, and Cybernetics (SMC), Oct 6-9, Bari, Italy.
- Hochberg, L., Mulino, J., Gupta, A., Cecil, J., Lopez-Aramburo, A. (2019), Exploring the role of Simulation-based Design principles in support of transportation and material handling activities for the Lunar Mission, Proceedings of the 2019 IEEE International Conference on Systems, Man, and Cybernetics (SMC), Oct 6-9, 2019, Bari, Italy.
- Cecil, J., The Role of Information Centric Frameworks in supporting Cyber-Physical Collaboration for Emerging Process Domains, Proceedings of the 13th Annual IEEE International Systems Conference, April 8-11, 2019, Orlando, Florida.
- Cecil, J., Krishnamurthy, R., and Gupta, A., Exploring Immersive Simulation based Design Frameworks in Support of the Moon Mission, Proceedings of the 13th Annual IEEE International Systems Conference, Orlando, Florida, April 8-11, 2019.
- Cecil, J., Cecil-Xavier, A. and Albuhamood, S., An Internet-of-Things (IoT) based framework for collaborative cyber physical tasks in micro assembly, Proceedings of the International Mechanical Engineering Congress & Exposition (IMECE), Pittsburgh, November 11-14, 2018.
- Cecil, J., Krishnamurthy, R., Huynh, H., Tapia, O., Ahmed, T., and Gupta, A., Simulation based Design Approaches for Study of Transportation and Habitat Alternatives for Deep Space Missions, Proceedings of IEEE Systems Man Cybernetics (SMC) conference, Miyazaki, Japan, Nov 7- 10, 2018.
- Cecil, J., Albuhamood, S, Cecil-Xavier, A., An Industry 4.0 Cyber-Physical Framework for Micro Devices Assembly, Proceedings of 14th IEEE International Conference on Automation Science and Engineering (IEEE CASE), Munich, Germany, August 20-24, 2018.
- Cecil J., Albuhamood, S., A Virtual Reality based Cyber Physical framework for micro devices assembly, Proceedings of the Twelfth International Symposium on Tools and Methods of Competitive Engineering (TMCE 2018), Las Palmas de Gran Canaria, Gran Canaria, Spain, May 7 – 11 2018.
- Krishnamurthy, R., Cecil, J., A next generation IoT framework for PCB assembly using cyber and physical resources, Proceedings of the 2018 Annual IEEE International Systems Conference (SysCon), Vancouver, Canada, April 23-26, 2018.
- Cecil, J., Sweet-Darter, M., Cecil-Xavier, A., Exploring the use of Virtual Learning Environments to support science learning in autistic students, Proceedings of the 2017 Frontiers in Engineering FIE / IEEE conference, Indianapolis, Oct 18 – 20, 2017.
- Cecil, J., Cecil-Xavier, A., Gupta, A., Foundational Elements of Next Generation Cyber Physical and IoT Frameworks for Distributed Collaboration, Proceedings of the 2017 13th IEEE Conference on Automation Science and Engineering (CASE 2017), Xian, China, Aug 20 – 23.
- Krishnamurthy, R., Cecil, J., Perera, D., An Internet-of-Things based Framework for Collaborative Manufacturing, Proceedings of the 2017 International Mechanical Engineering Congress & Exposition, Miami, Florida, Nov 3-9, 2017.
- Cecil, J., Cecil-Xavier, A., Krishnamurthy, R. Emergence of Next Generation IoT based Cyber-Physical Frameworks for collaborative manufacturing, Proceedings of the 7th International Conference on Information Society and Technology (ICIST) 2017, Zdravković, M., Konjović, Z., Trajanović, M. (Eds.), Kopaonik, Serbia, March 12-15, 2017, Vol.1, pp.251-256.
- Cecil, J., Gunda, R., Cecil-Xavier, A., A Next Generation Collaborative System for Micro Devices Assembly, Proceedings of 2017 Annual IEEE International Systems Conference (SysCon), April 24-27, Montreal, Canada.
- Cecil, J., Albuhamood, S., An Internet of Things based Cyber Physical Test Bed for Collaborative Manufacturing, Proceedings of the ASME 2016 International Mechanical Engineering Congress, Nov 11-17, Phoenix, AZ.
- Cecil, J., Albuhamood, S., An Integrated Collaborative Approach for Micro Devices Assembly, Proceedings of the 11th International Workshop on Enterprise Integration, Interoperability and Networking (EI2N), On the Move to Meaningful Internet Systems Confederated International Conferences: OTM 2016 Workshops, Rhodes, Greece, Oct 24- 28, 2016, Lecture Notes in Computer Science (LNCS) Vol 10034, pp.57-64.
- Lu, Y., Cecil, J., Mayfield, B., Ramanathan, P., A next generation IoT based approach for collaborative manufacturing, Proceedings of the 2016 Industrial and Systems Engineering Research Conference, Anaheim, CA, May 2016.
- Lu, Y., Cecil, J., Zafar, Z. The creation of Collaborative Cyber Physical Environments for Micro Assembly, Proceedings of the ASME 2015 International Mechanical Engineering Congress & Exposition, November 13-19, 2015, Houston, Texas.